Camera module test apparatus, camera module test method and image generating device

ABSTRACT

A camera module test apparatus having improved performance include a coefficient data extractor that accommodates a camera module; and a test apparatus that accommodates the camera module and tests the camera module. The coefficient data extractor includes a coefficient generator that receives an image signal output from the camera module, and generates coefficient data of a ratio of a first color image signal and a second color image signal included in the image signal; and a memory device that stores the generated coefficient data. The test apparatus includes an image generator that receives an image signal from the camera module and coefficient data from the memory device, and generates a converted pattern image signal based on the image signal and the coefficient data; and a calibration data generator that generates calibration data of the converted pattern image signal.

CROSS-REFERENCE TO RELATED APPLICATION

This is a Continuation of U.S. application Ser. No. 17/316,310, filedMay 10, 2021, and a claim priority under U.S.C. § 119 is made to KoreanPatent Application No. 10-2020-0149182 filed on Nov. 10, 2020 in theKorean Intellectual Property Office, the entirety of which is herebyincorporated by reference.

BACKGROUND

The present disclosure relates to camera module test apparatuses, cameramodule test methods, and image generating devices.

Image sensing devices typically include semiconductor elements thatconvert optical information into electric signals. Charge coupled device(CCD) image sensing devices and complementary metal-oxide semiconductor(CMOS) image sensing devices are examples of image sensing devices.

A CMOS image sensor may be characterized as a CIS (CMOS image sensor). ACIS may include a plurality of pixels arranged two-dimensionally. Eachof the pixels may include, for example, a photodiode (PD). Thephotodiodes convert incident light into electrical signals.

With development of the computer industry and the telecommunicationsindustry, there has recently been increasing demand for image sensorshaving improved performance for use in digital cameras, video cameras,smartphones, game consoles, security cameras, medical micro cameras, androbots, for example.

Camera modules used in electronic devices may include image sensors.Camera module test apparatuses may be used to improve performance andprevent defects of camera modules including image sensors. For example,camera module test apparatuses may improve the performance of a cameramodule by determining whether the camera module is defective, and ifdetermined defective, by storing calibration data corresponding to thedefect in the camera module.

SUMMARY

Embodiments of the inventive concepts provide a camera module testapparatus, a camera module test method and an image generating deviceeach having improved performance.

Embodiments of the inventive concepts provide a camera module testsystem including a coefficient data extractor removably connected to acamera module; and a test apparatus removably connected to the cameramodule, and that tests the camera module. The coefficient data extractorincludes a coefficient generator that receives an image signal outputfrom the camera module, and generates coefficient data corresponding toa ratio of a first color image signal and a second color image signalincluded in the image signal; and a memory device that stores thegenerated coefficient data. The test apparatus includes an imagegenerator that receives the image signal from the camera module and thecoefficient data from the memory device, and generates a convertedpattern image signal based on the image signal and the coefficient data;and a calibration data generator that generates calibration data basedon the converted pattern image signal.

Embodiments of the of the inventive concepts further provide a cameramodule test apparatus including a memory that stores first coefficientdata generated based on a ratio of a first color image signal and asecond color image signal output by sensing light penetrating through afirst color filter having a first arrangement, and second coefficientdata generated based on a ratio of a third color image signal and afourth color image signal output by sensing the light penetratingthrough a second color filter having a second arrangement different fromthe first arrangement; and an image conversion device that selects oneof the first coefficient data and the second coefficient data based onan arrangement of color filters included in an image sensor of a cameramodule to convert an image output from the image sensor into a convertedimage.

Embodiments of the of the inventive concepts still further provide acamera module test method including providing light to a first cameramodule; receiving a first image signal output from the first cameramodule in response to the light; generating coefficient datacorresponding to a ratio of a first color image signal and a secondcolor image signal included in the first image signal; storing thecoefficient data; providing the light to a second camera module;receiving a second image signal output from the second camera module inresponse to the light and the stored coefficient data; generating afirst converted pattern image signal based on the second image signaland the coefficient data received after being stored; and generatingfirst calibration data of the first converted pattern image signal.

Embodiments of the of the inventive concepts also provide a cameramodule test method including providing a first camera module having afirst color filter; receiving a first image signal output by sensinglight penetrating through the first color filter of the first cameramodule; generating first coefficient data corresponding to a ratio of aplurality of color image signals included in the first image signal;storing the first coefficient data; providing a second camera modulehaving a second color filter; checking whether the second color filtermatches the first color filter; and when the second color filter matchesthe first color filter, generating a first converted pattern imagesignal based on the stored first coefficient data and a second imagesignal output by sensing light penetrating through the second colorfilter of the second camera module, and generating calibration data ofthe first converted pattern image signal.

Embodiments of the of the inventive concepts further provide an imagegenerating device including a coefficient data extractor removablyconnected to a camera module; and an image conversion device removablyconnected to the camera module, and that converts an image output fromthe camera module into a converted image. The coefficient data extractorreceives an image signal output from the camera module, and generatescoefficient data corresponding to a ratio of a first color image signaland a second color image signal included in the image signal. The imageconversion device converts the image into the converted image that is agray image using the coefficient data.

Embodiments of the of the inventive concepts additionally provide acamera module test apparatus including a connector removably connectedto a camera module, the camera module including an image sensor thatoutputs an image signal responsive to incident light; a coefficientgenerator that generates coefficient data corresponding to a ratio of aplurality of color image signals included in the image signal, the imagesignal provided to the coefficient generator through the connector; amemory device that stores the coefficient data; an image converter thatreceives the image signal through the connector and converts the imagesignal into a converted pattern image signal using the storedcoefficient data; and a calibration data generator that generatescalibration data based on the converted pattern image signal.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other embodiments and features of the inventive conceptswill become more apparent in view of the following detailed descriptionas made with reference to the attached drawings, in which:

FIG. 1 illustrates a block diagram of a camera module test systemaccording to embodiments of the inventive concepts.

FIG. 2 illustrates a block diagram of the camera module of FIG. 1.

FIG. 3 illustrates a diagram showing a conceptual layout of an imagesensor according to embodiments of the inventive concepts.

FIG. 4 illustrates a diagram explanatory of a pixel array according toembodiments of the inventive concepts.

FIG. 5 illustrates a cross-sectional view of the pixel array taken alonga line A-A of FIG. 4.

FIG. 6 illustrates a diagram explanatory of an image signal according toembodiments of the inventive concepts.

FIG. 7 illustrates a coefficient data extractor according to embodimentsof the inventive concepts.

FIG. 8 illustrates a block diagram of the coefficient data extractor ofFIG. 7.

FIG. 9 illustrates a flowchart explanatory of operation of thecoefficient data extractor according to embodiments of the inventiveconcepts.

FIG. 10 illustrates a graph explanatory of the quantum efficiency of animage signal according to embodiments of the inventive concepts.

FIG. 11 illustrates a camera module test apparatus according toembodiments of the inventive concepts.

FIG. 12 illustrates a block diagram of the camera module test apparatusof FIG. 11.

FIG. 13 illustrates a flowchart explanatory of operation of the cameramodule test apparatus according to embodiments of the inventiveconcepts.

FIGS. 14 and 15 illustrate diagrams explanatory of the operation of thecamera module test apparatus of FIGS. 11 to 13.

FIG. 16 illustrates a block diagram of an image sensing apparatusaccording to embodiments of the inventive concepts.

FIG. 17 illustrates a block diagram of an image sensing apparatusaccording to embodiments of the inventive concepts.

FIG. 18 illustrates a block diagram of a camera module test systemaccording to embodiments of the inventive concepts.

FIG. 19 illustrates a block diagram of the camera module test apparatusof FIG. 18.

FIG. 20 illustrates a block diagram of a camera module test systemaccording to embodiments of the inventive concepts.

FIG. 21 illustrates a block diagram of a camera module test systemaccording to embodiments of the inventive concepts.

FIG. 22 illustrates a flowchart explanatory of the operation of thecamera module test system of FIG. 21.

FIG. 23 illustrates a block diagram explanatory of an electronic deviceincluding a multi-camera module according to embodiments of theinventive concepts.

FIG. 24 illustrates a detailed block diagram of the camera module ofFIG. 23.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, embodiments according to the technical idea of the presentdisclosure will be described referring to the accompanying drawings.

As is traditional in the field of the inventive concepts, embodimentsmay be described and illustrated in terms of blocks which carry out adescribed function or functions. These blocks, which may be referred toherein as units or modules or the like, are physically implemented byanalog and/or digital circuits such as logic gates, integrated circuits,microprocessors, microcontrollers, memory circuits, passive electroniccomponents, active electronic components, optical components, hardwiredcircuits and the like, and may optionally be driven by firmware and/orsoftware. The circuits may, for example, be embodied in one or moresemiconductor chips, or on substrate supports such as printed circuitboards and the like. The circuits constituting a block may beimplemented by dedicated hardware, or by a processor (e.g., one or moreprogrammed microprocessors and associated circuitry), or by acombination of dedicated hardware to perform some functions of the blockand a processor to perform other functions of the block. Each block ofthe embodiments may be physically separated into two or more interactingand discrete blocks without departing from the scope of the inventiveconcepts. Likewise, the blocks of the embodiments may be physicallycombined into more complex blocks without departing from the scope ofthe inventive concepts.

FIG. 1 illustrates a block diagram of a camera module test systemaccording to embodiments of the inventive concepts. FIG. 2 illustrates ablock diagram of the camera module of FIG. 1.

Referring to FIG. 1, a camera module test system 1 includes acoefficient data extractor 10 and a camera module test apparatus 50.Here, although the coefficient data extractor 10 and the camera moduletest apparatus 50 are shown separately, embodiments of the inventiveconcepts are not limited thereto. For example, the coefficient dataextractor 10 and the camera module test apparatus 50 may be implementedas a single device and the operations may be performed under the sameenvironment.

The coefficient data extractor 10 may accommodate the camera module 100,and extract coefficient data CD of the camera module 100. For example,the camera module 100 may be separately provided and connected to thecoefficient data extractor 10. That is, the camera module 100 may not beincluded in or as part of the camera module test system 1. For example,that the coefficient data extractor 10 may accommodate the camera module100 may mean that the camera module 100 may be removably connected to,or removably connectable with, the coefficient data extractor 10. Thecoefficient data extractor 10 may provide the extracted coefficient dataCD to the camera module test apparatus 50.

The camera module test apparatus 50 may accommodate the camera module100, and convert the image signal that is output from the camera module100 into another image signal on the basis of the coefficient data CD.For example, that the camera module test apparatus 50 may accommodatethe camera module 100 may mean that the camera module 100 is removablyconnected to or removably connectable with the camera module testapparatus 50. Also, the camera module test apparatus 50 may generatecalibration data CRD, using the converted image signal.

Here, the camera module 100 used in the camera module test apparatus 50may be the same as the camera module 100 used in the coefficient dataextractor 10. However, embodiments of the inventive concepts are notlimited thereto, and the camera module 100 used in the camera moduletest apparatus 50 may be different from the camera module 100 used inthe coefficient data extractor 10.

The camera module test apparatus 50 may provide the generatedcalibration data CRD to the camera module 100. The calibration data CRDmay include information on whether the camera module 100 is defective.

Referring to FIG. 2, the camera module 100 may include an image sensor101, an image signal processor (ISP) 180, and a memory device 190.

The image sensor 101 may sense an image using light (not shown), tothereby generate an image signal IS. In some embodiments, although thegenerated image signal IS may be, for example, a digital signal,embodiments of the inventive concepts are not limited thereto and thegenerated image signal IS may be an analog signal.

The image signal IS may be provided to the image signal processor 180and processed. The image signal processor 180 may receive the imagesignal IS that is output from the buffer 170 of the image sensor 101,and process or treat the received image signal IS to be easilydisplayed.

In some embodiments, the image signal processor 180 may perform digitalbinning on the image signal IS that is output from the image sensor 101.The image signal IS that is output from the image sensor 101 may be araw image signal from the pixel array PA without analog binning, or theimage signal IS output from the image sensor 101 may be a signal ofwhich analog binning has already been performed.

In some embodiments, the image sensor 101 and the image signal processor180 may be placed separately from each other, as shown. For example, theimage sensor 101 may be mounted on a first chip, and the image signalprocessor 180 may be mounted on a second chip and may communicate withthe image sensor 101 through a predetermined interface. However, theembodiments are not limited thereto, and the image sensor 101 and theimage signal processor 180 may be implemented as a single package suchas for example an MCP (multi-chip package).

The image signal processor 180 may be connected to a memory device 190.The calibration data CRD may be stored in the memory device 190. Here,the calibration data CRD may be provided from the camera module testsystem 1 of FIG. 1. The memory device 190 may include a non-volatilememory device. For example, the memory device 190 may include a memorychip such as non-volatile memory (e.g., ROM or flash memory).

The memory device 190 may provide the stored calibrated data CRD to theimage signal processor 180. The image signal processor 180 may correctthe image signal IS by the use of the calibration data CRD and output acalibrated image signal IS′. The image signal IS′ may be provided to adisplay (not shown) at which a corresponding image may be displayed.However, embodiments of the inventive concepts are not limited thereto,and the image signal IS may be output and displayed.

The image sensor 101 may include a control register block 110, a timinggenerator 120, a row driver 130, a pixel array PA, a readout circuit150, a ramp signal generator 160, and a buffer 170.

The control register block 110 may generally control the operation ofthe image sensor 101. In particular, the control register block 110 maydirectly transmit an operation signal to the timing generator 120, theramp signal generator 160, and the buffer 170.

The timing generator 120 may generate a signal that serves as areference for the operation timing of various components of the imagesensor 101. The operation timing reference signal generated by thetiming generator 120 may be transferred to the row driver 130, thereadout circuit 150, the ramp signal generator 160, and the like.

The ramp signal generator 160 may generate and transmit a ramp signalused in the readout circuit 150. For example, the readout circuit 150may include a correlated double sampler (CDS), a comparator, and thelike, and the ramp signal generator 160 may generate and transmit a rampsignal used by the correlated double sampler (CDS), the comparator, andthe like.

The buffer 170 may include, for example, a latch. The buffer 170 maytemporarily store an image signal IS to be provided to the outside, andmay transmit the image signal IS to an external memory or to an externaldevice. The buffer 170 may include, for example, DRAM, SRAM, or thelike. However, embodiments of the inventive concepts not limitedthereto, and the buffer 1170 may include memory such as MRAM.

The pixel array PA may sense external images. The pixel array PA mayinclude a plurality of pixels (or unit pixels). The row driver 130 mayselectively activate rows of the pixel array PA.

The readout circuit 150 may sample the pixel signal provided from thepixel array PA, compare it to the ramp signal, and then convert ananalog image signal (data) into a digital image signal (data) on thebasis of the results of the comparison.

FIG. 3 illustrates a diagram showing a conceptual layout of an imagesensor according to embodiments of the inventive concepts.

Referring to FIG. 3, the image sensor 101 may include a first region S1and a second region S2 stacked in a first direction (e.g., a verticaldirection). The first region S1 and the second region S2 may extend in asecond direction and a third direction intersecting the first direction,and blocks shown in FIG. 2 may be placed in the first region S1 and thesecond region S2.

Although not shown in the drawings, a third region in which the memoryis placed may be placed below the second region S2. The memory placed inthe third region may receive, store or process the image data from thefirst region S1 and the second region S2, and re-transmit the image datato the first region S1 and the second region S2. In this case, thememory may include memory elements such as DRAM (dynamic random accessmemory), SRAM (static random access memory), STT-MRAM (spin transfertorque magnetic random access memory), and flash memory. When the memoryincludes, for example, DRAM, the memory may receive and process imagedata at a relatively high speed. Also, in some embodiments, the memorymay also be placed in the second region S2.

The first region S1 may include a pixel array PA and a first peripheralregion PH1, and the second region S2 may include a logic circuit regionLC and a second peripheral region PH2. The first region S1 and thesecond region S2 may be sequentially stacked one above the other.

In the first region S1, the pixel array PA may be the same as the pixelarray PA described referring to FIG. 2. A pixel array PA may include aplurality of unit pixels arranged in the form of a matrix. Each pixelmay include a photo diode and transistors. A more specific descriptionthereof will be provided hereinafter.

The first peripheral region PH1 may include a plurality of pads, and maybe placed around the pixel array PA. The plurality of pads may transmitand receive electrical signals from an external device or the like.

In the second region S2, a logic circuit region LC may includeelectronic elements including a plurality of transistors. The electronicelements included in the logic circuit region LC may be electricallyconnected to the pixel array PA to provide a constant signal to eachunit pixel of the pixel array PA or control the output signal.

For example, the control register block 110, the timing generator 120,the row driver 130, the readout circuit 150, the ramp signal generator160, the buffer 170, and the like described referring to FIG. 2 may beplaced in the logic circuit region LC. For example, blocks from amongthe blocks of FIG. 2 other than the pixel array PA may be placed in thelogic circuit region LC.

Also in the second region S2, the second peripheral region PH2 may beplaced in the region corresponding to the first peripheral region PH1 ofthe first region S1. However, embodiments of the inventive concepts arenot limited thereto.

FIG. 4 illustrates a diagram explanatory of a pixel array according toembodiments of the inventive concepts. FIG. 5 illustrates across-sectional view of the pixel array taken along a line A-A of FIG.4.

Referring to FIG. 4, the pixel array PA may include a plurality of unitpixels PX. A plurality of unit pixels PX may be arrangedtwo-dimensionally. For example, a plurality of unit pixels PX may beplaced repeatedly in the second direction and the third direction (e.g.,see FIG. 3). The unit pixels PX may be arranged at regular intervals.For example, pixel arrays PA may be arranged in a Bayer pattern.However, embodiments of the inventive concepts are not limited thereto,and the pixel array PA may also be arranged in a tetra pattern, a nonapattern, or the like.

Referring to FIG. 5, the pixel array PA may include a unit pixel PX1 anda unit pixel PX2. The unit pixel PX1 and the unit pixel PX2 may bearranged to be adjacent to each other.

The pixel array PA may include substrates 146W and 146B, photoelectrictransistors 148W and 148B, an antireflection film 147, a sideantireflection film 144, color filters 143W and 143B, an upperflattening film 142, a lower flattening film 145, and microlenses 141-1and 141-2.

As the substrates 146W and 146B, for example, a P-type or N-type bulksubstrate may be used, a P-type or N-type epi layer grown on the P-typebulk substrate may be used, or a P-type or N-type epi layer grown on theN-type bulk substrate may be used. The substrates 146W and 146B may alsoinclude a substrate such as an organic plastic substrate, in addition tothe semiconductor substrate.

The photoelectric transistors 148W and 148B may be photo diodes, phototransistors, photo gates, pinned photo diodes, or a combination thereof.

The antireflection film 147 and the side antireflection film 144 mayprevent light, which is incident on the external microlenses 141-1 and141-2 from outside, from penetrating a region W and a region B. Theantireflection film 147 and the side antireflection film 144 may be aninsulating film such as silicon oxide film, silicon nitride film,silicon oxynitride film, a resin and a combination thereof, or alaminate thereof. However, the embodiments are not limited thereto.

The upper flattening film 142 and the lower flattening film 145 may beformed flat with the color filters 143W and 143B interposedtherebetween. The upper flattening film 142 and the lower flatteningfilm 145 may include at least one of silicon oxide film-based material,silicon nitride film-based material, a resin or a combination thereof.However, embodiments are not limited thereto.

FIG. 6 illustrates a diagram explanatory of an image signal according toembodiments of the inventive concepts.

Referring to FIG. 6, the image signal IS may be a signal which is outputby sensing the light from the pixel array PA by the image sensor 101.For example, light may penetrate through the color filters 143W and 143Bof the pixel array PA and reach the photoelectric transistors 148W and148B, and the image signal IS may be output from the logic circuitregion LC in response to this.

For example, the image signal IS may include a first white pixel valueW1 which is output by sensing the light penetrating through a colorfilter 143W having a white color. Also, the image signal IS may includea blue pixel value B1 which is output by sensing the light penetratingthrough a color filter 143B having a blue color. That is, the whitepixel values W1 to W8, the green pixel values G1 to G4, the blue pixelvalues B1 and B2, and the red pixel values R1 and R2 shown in FIG. 6 maybe an image signal IS which is output by sensing the light penetratingthrough color filters having the corresponding color by the image sensor101.

The pixel array PA may be arranged in an RGBW Bayer pattern. That is,the color filters of the pixel array PA may be a combination of a redcolor filter, a green color filter, a blue color filter and a whitecolor filter, and the color filters may be arranged in a Bayer pattern.However, embodiments of the inventive concepts are not limited thereto,and the pixel array PA may for example be arranged in an RGB Bayerpattern, an RGB tetra pattern, a CMY pattern, a RYYB pattern, and thelike.

The pixel values of the image signal IS may be arranged to correspond tothe colors of the color filters of the pixel array PA, as shown in FIG.6. However, FIG. 6 is merely an arrangement of each pixel valueaccording to the position of each unit pixel PX, and the storageposition of the pixel value of the actually output image signal IS isnot limited to the shown position.

FIGS. 7 and 8 illustrate diagrams explanatory of a coefficient dataextractor according to embodiments of the inventive concepts. FIG. 9illustrates a flowchart explanatory of the operation of the coefficientdata extractor according to embodiments of the inventive concepts.

Referring to FIG. 7, the coefficient data extractor 10 included in thecamera module test system 1 may include a light source emitter 20, afixer 21, and a connector 22.

Referring to FIGS. 7 to 9, the camera module 100 may be accommodatedinside the coefficient data extractor 10. That is, the camera module 100may be provided to the coefficient data extractor 10 of the cameramodule test system 1 from the outside. For example, the camera module100 may be externally connected to the coefficient data extractor 10.

The camera module 100 may be placed on the fixer 21 and may be connectedto the connector 22. Also, the camera module 100 may be fixed on thefixer 21. An interface or a connector of the camera module 100 may beconnected to the connector 22 of the coefficient data extractor 10 totransmit and receive data. For example, as shown in FIG. 8, the imagesignal IS output from the camera module 100 may be transferred to theconnector 22. Further, the image signal IS may be transferred to thecoefficient generator 30 through the connector 22.

The light source emitter 20 is placed above the fixer 21 and the cameramodule 100. The light source emitter 20 emits light L to the cameramodule 100 (S200 in FIG. 9). Here, the light L may include, for example,EDS light (Electric die sorting light). For example, the light L mayinclude white light. That is, the light L emitted from the light sourceemitter 20 may include light of all wavelengths. The light L may includeall of light of the red component, light of the green component, andlight of the blue component. However, embodiments of the inventiveconcepts are not limited thereto.

The camera module 100 may allow light L emitted from the light sourceemitter 20 to enter. For example, the image sensor 101 of the cameramodule 100 may sense light L and output the image signal IS. Here, thelight L that has reached the pixel array PA is converted by thephotoelectric transistors 148W and 148B and may be output as the imagesignal IS by the readout circuit 150.

The coefficient generator 30 receives the image signal IS generated fromthe camera module 100 (S201).

The coefficient generator 30 generates coefficients on the basis of theimage signal IS (S202). That is, the coefficient generator 30 maygenerate the coefficient data CD, using the image signal IS.

FIG. 10 illustrates a graph explanatory of the quantum efficiency of animage signal according to embodiments of the inventive concepts.

Referring to FIG. 10, a quantum efficiency QE of each color image signalmay be different from each other, depending on the wavelength. Forexample, the quantum efficiency of a blue color image signal B may belarge at a short wavelength of 450 nm, and may be small at a longwavelength of 650 nm. For example, the quantum efficiency of a greencolor image signal G may be large at an intermediate wavelength of 550nm, and may be small at a short wavelength of 450 nm and a longwavelength of 650 nm. For example, the quantum efficiency of a red colorimage signal R may be large at a long wavelength of 650 nm, and may besmall at a short wavelength of 450 nm. Each color image signal may bechanged depending on the wavelength. However, embodiments of theinventive concepts are not limited thereto.

Here, the magnitude of the white color image signal W may correspond toan integral value of the wavelengths of the magnitude of the green colorimage signal G, the magnitude of the red color image signal R, and themagnitude of the blue color image signal B. That is, the magnitude ofthe white color image signal W may be expressed by the followingEquation 1.

W=∫ _(λ) _(min) ^(λ) ^(max) C1*R+C2*G+C3*Bdλ  <Equation 1>

The white color image signal W may be expressed linearly, using thegreen color image signal G, the red color image signal R, and the bluecolor image signal B. The magnitude of the white color image signal Wmay be expressed by Equation 2 below.

W=C1R+C2*G+C3*B  <Equation 2>

That is, the white color image signal W may be made up of a constantratio of the green color image signal G, the red color image signal R,and the blue color image signal B, wherein C1, C2 and C3 respectivelyare the magnitudes of the red color image signal, the green color imagesignal and the blue color image signal.

Each of the green color image signal G, the red color image signal R,and the blue color image signal B may have a certain relationalexpression with respect to each other. The green color image signal Gexpressed with respect to the blue color image signal B may correspondto Equation 3 below, and the red color image signal R expressed withrespect to the blue color image signal B may correspond to Equation 4below.

G=k1*B+k2  <Equation 3>

R=k3*+k4  <Equation 4>

When Equations 3 and 4 are substituted into Equation 2, the followingEquation is obtained.

$\begin{matrix}\begin{matrix}{W = {{C1*\left( {{k3*B} + {k4}} \right)} +}} \\{{C2*\left( {{k1*B} + {k2}} \right)} + {C3*B}} \\{= {{\left( {{C1*k3} + {C2*k1} + {C3}} \right)*B} +}} \\\left( {{C1*k4} + {C2*k2}} \right) \\{= {{{XB}*B} + {KB}}}\end{matrix} & \left\langle {{Equation}5} \right\rangle\end{matrix}$

Accordingly, the white color image signal W may be expressed using theblue color image signal B. That is, the white color image signal W maybe expressed using the blue color coefficient XB and the blue colorconstant KB.

The white color image signal W may be expressed using the red colorimage signal R, and may be expressed using the green color image signalG. Equations thereof are as follows:

X=XR*R+KR  <Equation 6>

W=XG*G+KG  <Equation 7>

Here, the white color image signal W may be expressed using the redcolor coefficient XR and the red color constant KR. Also, the whitecolor image signal W may be expressed using the green color coefficientXG and the green color constant KG.

Here, when the light L includes all wavelengths, the constants of eachrelational expression may be omitted. For example, the blue colorconstant KB, the red color constant KR, and the green color constant KGmay be omitted from each Equation. Thus, the relational expression ofeach color image signal is as follows. However, embodiments of theinventive concepts are not limited thereto.

W=XB*B

W=XR*R

W=XG*G  <Equation 8>

Thus, the coefficient generator 30 may generate coefficient data CD onthe basis of the image signal IS. Here, the coefficient data CD mayinclude a blue color coefficient XB, a red color coefficient XR, and agreen color coefficient XG. That is, the coefficient data may be a ratioof a single color image signal to another color image signal.

Subsequently, the coefficient data extractor 10 may store thecoefficient data CD in the memory device 40 (S203 in FIG. 9). Thecoefficient generator 30 may provide the generated coefficient data CDto the memory device 40. The memory device 40 may store the providedcoefficient data CD. Here, the memory device 40 may store thecoefficient data CD to match the type of camera module 100 used for thecoefficient data extractor 10. For example, when the color filter typeof the camera module 100 is RGBW, the coefficient data CD generated inthe case of RGBW may be stored. However, embodiments of the inventiveconcepts are not limited thereto.

A method of extracting the coefficient data CD described referring toFIGS. 7 to 10 may be performed before the test method of the cameramodule 100 is performed. That is, if a plurality of camera modules 100need to be tested, the coefficient data CD of only one representativecamera module 100 may be extracted. Next, a plurality of camera modules100 may be tested, using the coefficient data CD. This makes it possibleto reduce the test time of the camera module test apparatus 50, and thecamera module 100 can be tested, even without hardware which converts aspecific image signal to an RGB image signal. That is, performance ofthe camera module test system 1 can be improved.

FIGS. 11 and 12 illustrate diagrams explanatory of a camera module testapparatus according to embodiments of the inventive concepts. FIG. 13illustrates a flowchart explanatory of the operation of the cameramodule test apparatus according to embodiments of the inventiveconcepts. FIGS. 14 and 15 illustrate diagrams explanatory of theoperation of the camera module test apparatus of FIGS. 11 to 13.

Referring to FIG. 11, the camera module test apparatus 50 included inthe camera module test system 1 may include a light source emitter 51, afixer 52, and a connector 53.

Referring to FIGS. 11 to 13, the camera module 100 may be accommodatedinside the camera module test apparatus 50. That is, the camera module100 may be provided to the camera module test apparatus 50 of the cameramodule test system 1 from the outside. For example, the camera module100 may be externally connected to the camera module test apparatus 50.

The camera module 100 may be placed on the fixer 52 and may be connectedto the connector 53. Also, the camera module 100 may be fixed on thefixer 52. An interface or a connector of the camera module 100 may beconnected to the connector 53 of the camera module test apparatus 50 totransmit and receive data. For example, as shown in FIG. 12, the imagesignal IS which is output from the camera module 100 may be transferredto the connector 53. Also, the image signal IS may be transferred to agray image generator 60 through the connector 53.

The light source emitter 51 is placed above the fixer 52 and the cameramodule 100. The light source emitter 51 emits light L to the cameramodule 100 (S210 in FIG. 13). Here, the light L may include, forexample, white light. The camera module 100 may output an image signalIS in response to the incident light L.

The gray image generator 60 receives the image signal IS generated fromthe camera module 100 through the connector 53, and the coefficient dataCD from the memory device 40 of the coefficient data generator 10 suchas shown in FIG. 8 (S211). The gray image generator 60 may receivecoefficient data CD previously stored in the memory device 40. Here, thecoefficient data CD may be generated and stored prior to the operationof the camera module test apparatus 50.

In this embodiment, although the camera module test apparatus 50 and thecoefficient data extractor 10 are shown as being placed separately, thecamera module test apparatus 50 and the coefficient data extractor 10may be implemented in a single device. That is, the operation of thecamera module test apparatus 50 and the coefficient data extractor 10may be performed under the same environment. That is, the light L usedin the camera module test apparatus 50 and the coefficient dataextractor 10 may be the same, and the camera module 100 may also be thesame. However, embodiments of the inventive concepts are not limitedthereto.

The gray image generator 60 generates a gray image signal GIS on thebasis of the image signal IS and the coefficient data CD (S212). Thatis, the gray image generator 60 may convert the image signal ISgenerated from the camera module 100 into a gray image signal GIS, usingthe coefficient data CD. Here, the image signal generated from the grayimage generator 60 is not limited to the gray image signal GIS. That is,the gray image generator 60 may generate another converted pattern imagesignal. For example, the gray image generator 60 may also convert theimage signal IS into the RGB Bayer pattern image signal using thecoefficient data CD. However, embodiments of the inventive concepts arenot limited thereto.

Referring to FIG. 14, the image signal may include white pixel values W1to W8, green pixel values G1 to G4, blue pixel values B1 and B2, and redpixel values R1 and R2. The coefficient data CD stored in the memorydevice 40 may include the blue color coefficients XB1 and XB2, red colorcoefficients XR1 and XR2, green color coefficients XG1, XG2, XG3 andXG4, and the like. Here, the blue color coefficients XB1 and XB2 mayrespectively correspond to the blue pixel values B1 and B2, and the redcolor coefficients XR1 and XR2 may respectively correspond to the redpixel values R1 and R2, and the green color coefficients XG1, XG2, XG3and XG4 may respectively correspond to the green pixel values G1 to G4.

The gray image signal GIS may be generated by applying the coefficientdata CD to the image signal IS. For example, a gray pixel value Wg1 maybe generated on the basis of a blue pixel value B1 and a blue colorcoefficient XB1 according to Equation 9 below.

Wg1=B1*XB1  <Equation 9>

Also, the gray pixel value Wg3 may be generated on the basis of thegreen pixel value G1 and the green color coefficient XG1 according toEquation 10 below.

Wg3=G1*XG1  <Equation 10>

Also, the gray pixel value Wg7 may be generated on the basis of the redpixel value R1 and the red color coefficient XR1 according to Equation11 below.

Wg7=R1*XR1  <Equation 11>

Therefore, the gray image signal GIS may be generated on the basis ofthe image signal IS and the coefficient data CD. The gray image signalGIS may include a gray image. That is, an image signal IS having anoriginal image may be converted into a gray image signal GIS having agray image. The gray image signal GIS may be provided to the calibrationdata generator 70.

The calibration data generator 70 may process the image signal or thegray image signal of the RGB Bayer pattern. However, to generate thecalibration data CRD, hardware or the like that converts an image signalother than the image signal or the gray image signal of the RGB Bayerpattern into a corresponding signal may be required. However, inembodiments of the inventive concepts, because the coefficient data CDstored previously may be applied to the image signal IS to generate thegray image signal GIS, the calibration data generator 70 may generatethe calibration data CRD on the basis of the generated gray image signalGIS.

The calibration data generator 70 thus generates calibration data CRD onthe basis of the gray image of the gray image signal GIS (S213 in FIG.13).

The calibration data generator 70 may for example perform a shadingtest, a bad pixel test, a FPN test, or the like on the generated grayimage signal GIS. Although the calibration data generator 70 may performvarious types of tests, in embodiments of the inventive concepts,testing of bad pixels will be hereinafter described as an example.

Referring to FIG. 15, in the gray image signal GIS, the pixelcorresponding to a gray pixel value Wg4 and the pixel corresponding to agray pixel value Wg8 may be tested as bad pixels. As a result, the pixelcorresponding to the gray pixel value Wg4 may be expressed as a badpixel BP1, and the pixel corresponding to the gray pixel value Wg8 maybe expressed as a bad pixel BP2.

Thus, the calibration data CRD may include information about whichpixels are bad pixels. For example, the calibration data CRD may includean indication in which the pixel corresponding to the gray pixel valueWg4 is the bad pixel BP1, and may include an indication in which thepixel corresponding to the gray pixel value Wg8 is the bad pixel BP2.However, embodiments of the inventive concepts are not limited thereto.

Referring to FIGS. 12 and 13 again, the calibration data generator 70provides calibration data CRD to the camera module 100 (S214). Thecalibration data generator 70 may provide the generated calibration dataCRD to the memory device 80. Here, the memory device 80 may be avolatile memory device such as DRAM, or may be a non-volatile memorydevice such as flash memory. The memory device 80 may also be the sameas the memory device 40 in FIG. 8. The calibration data CRD which isread from the memory device 80 may be transferred to the camera module100.

FIGS. 16 and 17 illustrate block diagrams of an image sensing deviceaccording to embodiments of the inventive concepts.

Referring to FIGS. 2 and 16, an image sensing apparatus 300 a mayinclude a camera module 100 and an application processor AP.

A memory device 190 of the camera module 100 may receive the calibrationdata CRD from the memory device 80. The memory device 190 may store thecalibration data CRD. The memory device 190 may provide the calibrationdata CRD to the image signal processor 180 in response to an externalrequest. That is, when the image signal processor 180 executes imageprocessing on the image signal IS, the image signal IS may becalibrated, using the calibration data CRD stored in the memory device190. That is, the camera module 100 may output an image signal IS′having further improved image quality, by correcting the image signalIS, using the calibration data CRD generated from the camera module testsystem 1.

The calibrated image signal IS′ may be provided to the applicationprocessor AP. The application processor AP may additionally perform theimage processing on the provided image signal IS′. Further, the imagesignal IS′ subjected to the image processing may be output through adisplay.

However, embodiments of the inventive concepts are not limited thereto,and the application processor AP may also output the image signal IS′ tothe display as is without performing additional image processing.

Referring to FIG. 17, an image sensing apparatus 300 b may include acamera module 100 and an application processor AP.

The image signal processor 180 of the camera module 100 may receive thecalibration data CRD from the memory device 190. The image signalprocessor 180 may provide the image signal IS and the calibration dataCRD to the application processor AP. That is, the image signal processor180 may not perform image processing on the image signal IS using thecalibration data CRD. The application processor AP may perform imageprocessing of the image signal IS using the provided calibration dataCRD.

A camera module test system 1 a according to some other embodiments ofthe inventive concepts will be described below referring to FIGS. 18 and19.

FIG. 18 illustrates a block diagram of a camera module test systemaccording to embodiments of the inventive concepts. FIG. 19 illustratesa block diagram of the camera module test apparatus of FIG. 18. Forconvenience of explanation, description of features in FIGS. 18 and 19that are the same as in FIGS. 1 to 17 will be hereinafter omitted.

Referring to FIG. 18, the camera module test system 1 a may include acamera module test apparatus 50′. Unlike the configuration in which thecamera module test system 1 described referring to FIGS. 1 to 17includes the coefficient data extractor 10 and the camera module testapparatus 50, the camera module test system 1 a in FIG. 18 includes onlya camera module test apparatus 50′. Here, the function of coefficientdata extractor 10 may be implemented by the camera module test system50′.

The camera module 100 may be accommodated in the camera module testapparatus 50′, and may receive calibration data CRD that is output as anoperation result of the camera module test apparatus 50′.

Referring to FIG. 19, the camera module test apparatus 50′ may includeconnector 22, coefficient generator 30, memory device 40, gray imagegenerator 60, calibration data generator 70, and memory device 80.

The coefficient data extraction process and the camera module testprocess explained referring to FIGS. 1 through 17 may be performed bythe camera module test apparatus 50′. That is, unlike the configurationin which the coefficient data extraction process and the camera moduletest process are separately performed as described with reference toFIGS. 1 to 17, the camera module test apparatus 50′ may perform all theaforementioned processes.

The image signal IS which is output from the camera module 100 istransferred to the coefficient generator 30 through the connector 22,and the coefficient generator 30 may generate the coefficient data CD.Subsequently, the coefficient generator 30 may transfer the coefficientdata CD to the memory device 40, and the memory device 40 may store thecoefficient data CD.

In the subsequent process, the image signal IS which is output from thecamera module 100 may be transferred to the gray image generator 60.Also, the coefficient data CD which is output from the memory device 40may be transferred to the gray image generator 60. The gray imagegenerator 60 may convert the image signal IS into the gray image signalGIS, using the coefficient data CD. The calibration data generator 70may generate calibration data CRD on the basis of the generated grayimage signal GIS, and the generated calibration data CRD may be storedin the memory device 80. In some embodiments, the memory device 40 andthe memory device 80 may be the same memory device. Also, thecalibration data CRD may be transferred to the camera module 100 andstored.

In the camera module test apparatus 50′ according to embodiments of theinventive concepts, the coefficient data extraction process and thecamera module test process may be performed under the same environment.That is, the coefficient data CD may be used when generating the grayimage of the gray image generator 60 under the same environment.

Hereinafter, the camera module test system 1 b according to some otherembodiments of the inventive concepts will be described referring toFIG. 20.

FIG. 20 illustrates a block diagram of a camera module test systemaccording to embodiments of the inventive concepts. For convenience ofexplanation, description of features in FIG. 20 that are the same as inFIGS. 1 to 17 will be hereinafter omitted.

Referring to FIG. 20, the camera module test system 1 b may accommodatea plurality of camera modules 100, 100_1, 100_2, and 100_3. For example,the coefficient data extractor 10 may accommodate the camera module 100,and the camera module test apparatus 50 may accommodate the plurality ofcamera modules 100, 100_1, 100_2, and 100_3.

First, the coefficient data extractor 10 may accommodate the cameramodule 100 and extract the coefficient data CD thereof. The coefficientdata CD may be transferred to the camera module test apparatus 50.

Subsequently, the camera module test apparatus 50 may accommodate theused camera module 100, output the calibration data CRD by the use ofthe image signal IS output from the camera module 100 and thecoefficient data CD, and provide the calibration data CRD to the cameramodule 100.

Further, after the coefficient data CD is provided to the camera moduletest apparatus 50, a plurality of camera modules 100_1, 100_2, and 100_3may be accommodated in the camera module test apparatus 50. Here, theplurality of camera modules 100_1, 100_2, and 100_3 may be accommodatedat a same time or may be accommodated in sequence.

For example, the camera module 100_1 may be accommodated in the cameramodule test apparatus 50, and calibration data CRD_1 may be generatedusing the image signal that is output from the camera module 100_1 andthe stored coefficient data CD. The calibration data CRD_1 may beprovided to the camera module 100_1 and stored therein.

The camera module 100_2 may be accommodated in the camera module testapparatus 50, and calibration data CRD_2 may be generated using theimage signal that is output from the camera module 100_2 and the storedcoefficient data CD. The calibration data CRD_2 may be provided to thecamera module 100_2 and stored therein.

The camera module 100_3 may be accommodated in the camera module testapparatus 50, and calibration data CRD_3 may be generated using theimage signal that is output from the camera module 100_3 and the storedcoefficient data CD. The calibration data CRD_3 may be provided to thecamera module 100_3 and stored therein.

Here, patterns of the color filters of the image sensors of theplurality of camera modules 100_1, 100_2, and 100_3 may be the same aspatterns of the color filters of the image sensors of the camera module100. Also, the respective calibration data CRD, CRD_1, CRD_2 and CRD_3may be different from each other. However, the embodiments of theinventive concepts are not limited thereto.

Since the camera module test of the plurality of camera modules 100_1,100_2, and 100_3 is performed after the coefficient data CD isextracted, the time consumed for the camera module test can be reduced.That is, a more efficient camera module test can be performed.

Hereinafter, a camera module test system 1 c according to some otherembodiments of the inventive concepts will be described referring toFIGS. 21 and 22.

FIG. 21 illustrates a block diagram of a camera module test systemaccording to embodiments of the inventive concepts. FIG. 22 illustratesa flowchart explanatory of the operation of the camera module testsystem of FIG. 21. For convenience of explanation, description offeatures in FIGS. 21 and 22 that are the same as in FIGS. 1 to 17 willbe hereinafter omitted.

Referring to FIG. 21, the camera module test system 1 c may include acoefficient data extractor 10, a camera module test apparatus 50, and acamera module classifier 90.

Referring to FIGS. 21 and 22, the coefficient data extractor 10accommodates the camera modules 100 a, 100 b, and 100 c (S220). Thecoefficient data extractor 10 extracts the coefficient data CD1, CD2,and CD3 of the camera modules 100 a, 100 b, and 100 c, and stores theextracted coefficient data CD1, CD2, and CD3 (S221). Also, coefficientdata extractor 10 may provide the coefficient data CD1, CD2, and CD3 tothe camera module test apparatus 50.

Here, each of the camera modules 100 a, 100 b, and 100 c may be cameramodules different from each other. For example, patterns of the colorfilter included in each of the camera modules 100 a, 100 b, and 100 cmay be different from each other. For example, the pattern of the colorfilter of the camera module 100 a may be RGBW, the pattern of the colorfilter of the camera module 100 b may be RYYB, and the pattern of thecolor filter of the camera module 100 c may be CMY. Therefore, therespective coefficient data CD1, CD2, and CD3 may also be different fromeach other. However, embodiments of the inventive concepts are notlimited thereto.

The camera module test apparatus 50 accommodates or accepts one cameramodule (S222). Here, the one camera module may be provided or connectedto the camera module test apparatus 50 by the camera module classifier90.

The camera module classifier 90 may accommodate a plurality of cameramodules 100 a, 100 b, and 100 c. The camera module classifier 90 mayprovide (i.e., connect) the above noted one camera module of the cameramodules 100 a, 100 b, and 100 c accepted in S222 to the camera moduletest apparatus 50.

The camera module test apparatus 50 determines whether the provided(i.e., accepted) camera module corresponds to a camera module from whichcoefficient data has been extracted (S223). For example, when the cameramodule test apparatus 50 is provided (i.e., connected) with the cameramodule 100 a, the camera module test apparatus 50 may determine thecoefficient data CD1 as corresponding to the camera module 100 a.

When the accepted camera module corresponds to a camera module fromwhich the coefficient data has been extracted (Yes in S223), the cameramodule test apparatus 50 tests the accepted camera module on the basisof the coefficient data CD (S224). That is, the camera module testapparatus 50 may convert the image signal IS, which is output from theaccepted camera module, by the use of the corresponding coefficient dataCD. When the accepted camera module does not correspond to a cameramodule from which coefficient data has been extracted (No in S223),operation returns to S222 and another camera module may be accepted.

The camera module test apparatus 50 generates the calibration data CRDusing the generated gray image signal GIS (S225). Here, in accordancewith the above noted example in which the accepted camera module is thecamera module 100 a, calibration data CRD1 may be generated. If thecamera module 100 b is tested, calibration data CRD2 may be generated,and if the camera module 100 c is tested, calibration data CRD3 may begenerated.

Subsequently, the camera module test apparatus 50 provides calibrationdata to the corresponding camera module (S226). For example, calibrationdata CRD1, CRD2, and CRD3 may be respectively provided to the cameramodules 100 a, 100 b, and 100 c. For example, the camera module testapparatus 50 may provide the calibration data CRD1, CRD2, and CRD3 tothe camera module classifier 90. Subsequently, the camera moduleclassifier 90 may provide the calibration data CRD1 to the camera module100 a, and may provide the calibration data CRD2 to the camera module100 b. The camera module classifier 90 may provide calibration data CRD3to the camera module 100 c.

Accordingly, the camera module test system 1 c may efficiently store thecalibration data CRD1, CRD2, and CRD3 in each of the camera modules 100a, 100 b, and 100 c.

Hereinafter, an electronic apparatus 2000 according to some otherembodiments of the inventive concepts will be described referring toFIGS. 23 and 24.

FIG. 23 illustrates a block diagram explanatory of an electronic deviceincluding a multi-camera module according to embodiments of theinventive concepts. FIG. 24 illustrates a detailed block diagram of thecamera module of FIG. 23. For convenience of explanation, description offeatures in FIGS. 23 and 24 that are the same as in FIGS. 1 to 22 willbe hereinafter omitted.

Referring to FIG. 23, the electronic device 2000 may include a cameramodule group 2100, an application processor 2200, a power managementintegrated circuit (PMIC) 2300, an external memory 2400 and a display2500.

The camera module group 2100 may include a plurality of camera modules2100 a, 2100 b, and 2100 c. Even though the drawings show an embodimentin which three camera modules 2100 a, 2100 b, and 2100 c are included,the embodiments are not limited thereto. In some embodiments, the cameramodule group 2100 may be modified to include only two camera modules.Also, in some embodiments, the camera module group 2100 may also bedisposed to include n (n is a natural number of 4 or more) cameramodules.

Here, any one of the three camera modules 2100 a, 2100 b, and 2100 c mayinclude the camera module 100 described using FIGS. 1 to 22. That is,the camera module 100 tested by the camera module test systems 1, 1 a, 1b, and 1 c may be placed in the electronic device 2000.

Hereinafter, the detailed configuration of the camera module 2100 b willbe described in more detail referring to FIG. 24. However, the followingdescription may also be similarly applied to other camera modules 2100 aand 2100 c, depending on the embodiments.

Referring to FIG. 24, the camera module 2100 b may include a prism 2105,an optical path folding element (hereinafter, “OPFE”) 2110, an actuator2130, an image sensing device 2140, and a storage 2150.

The prism 2105 may include a reflective face 2107 of a light-reflectingmaterial that deforms a path of light L that is incident from theoutside.

In some embodiments, the prism 2105 may change the path of light Lincident in a first direction X to a second direction Y perpendicular tothe first direction X. Further, the prism 2105 may rotate the reflectiveface 2107 of the light-reflecting material in a direction A around acentral axis 2106, or rotate the reflective face 2107 in a direction Baround the central axis 2106 to change the path of the light L incidentin the first direction to the vertical second direction Y. The OPFE 2110may also move in a third direction Z perpendicular to the firstdirection X and the second direction Y.

In some embodiments, as shown, although a maximum rotation angle of theprism 2105 in the direction A is 15 degrees or less in a positive (+)direction A, and may be greater than 15 degrees in a negative (−)direction A, the embodiments are not limited thereto.

In some embodiments, the prism 2105 may move around 20 degrees, orbetween 10 and 20 degrees, or between 15 and 20 degrees in a positive(+) or negative (−) direction B. Here, a moving angle may move at thesame angle in the positive (+) or negative (−) direction B, or may moveto almost the similar angle in the range of about 1 degree.

In some embodiments, the prism 2105 may move the reflective face 2106 ofthe light-reflective material in a third direction (e.g., the directionZ) parallel to the extension direction of the central axis 2106.

The OPFE 2110 may include, for example, an optical lens including m(here, m is a natural number) groups. The m lenses may move in thesecond direction Y to change an optical zoom ratio of the camera module2100 b. For example, when a basic optical zoom ratio of the cameramodule 2100 b is defined as Zr, in the case of moving the m opticallenses included in the OPFE 2110, the optical zoom ratio of the cameramodule 2100 b may be changed to an optical zoom ratio of 3Zr or 5Zr orhigher.

The actuator 2130 may move the OPFE, 2110 or an optical lens(hereinafter referred to as an optical lens) to a specific position. Forexample, the actuator 2130 may adjust the position of the optical lensso that the image sensor 2142 is located at the focal length of theoptical lens for accurate sensing.

The image sensing apparatus 2140 may include an image sensor 2142,control logic 2144, and a memory 2146. The image sensor 2142 may sensethe image to be sensed using the light L provided through the opticallens. In some embodiments, the image sensor 2142 may include the imagesensor 101 previously described.

The control logic 2144 may control the overall operation of the cameramodule 2100 b. In an embodiment, the control logic 2144 may be a controllogic circuit and may include a processor configured to performpredetermined operations. For example, the control logic 2144 maycontrol the operation of the camera module 2100 b according to thecontrol signal provided through the control signal line CSLb.

The memory 2146 may store information necessary for the operation of thecamera module 2100 b, such as calibration data 2147. The calibrationdata 2147 may include information necessary for the camera module 2100 bto generate image data, using light L provided from the outside. Thecalibration data 2147 may include, for example, above-mentionedinformation on the degree of rotation, information on the focal length,information on the optical axis, and the like. If the camera module 2100b is provided in the form of a multi-state camera whose focal lengthchanges depending on the position of the optical lens, the calibrationdata 2147 may include focal length values for each position (or for eachstate) of the optical lens 2147, and information about auto-focusing.Here, the memory 2146 may include the memory device 190 of the cameramodule 100 described with respect to FIG. 2 for example, and thecalibration data 2147 may include the calibration data CRD stored in thememory device 190.

The storage 2150 may store the image data sensed through the imagesensor 2142. In some embodiments the storage 2150 may be placed outsidethe image sensing device 2140, and may be provided in the form of beingstacked with sensor chips constituting the image sensing device 2140. Insome embodiments, although the storage 2150 may be provided as EEPROM(Electrically Erasable Programmable Read-Only Memory), the embodimentsare not limited thereto. The storage 2150 may be implemented by a memorychip.

Referring to FIGS. 23 and 24 together, in some embodiments, each of theplurality of camera modules 2100 a, 2100 b, and 2100 c may include anactuator 2130. Accordingly, each of the plurality of camera modules 2100a, 2100 b, and 2100 c may include calibration data 2147 that are thesame as or different from each other, depending on the operation of theactuator 2130 included therein.

In some embodiments, although one camera module (e.g., 2100 b) of theplurality of camera modules 2100 a, 2100 b, and 2100 c may be a foldedlens type camera module including the prism 2105 and the OPFE 2110described above, and the remaining camera modules (e.g., 2100 a, 2100 c)may be a vertical type camera module which does not include the prism2105 and the OPFE 2110, the embodiments are not limited thereto.

In some embodiments, one camera module (e.g., 2100 c) of the pluralityof camera modules 2100 a, 2100 b, and 2100 c may be a vertical typedepth camera that extracts depth information, using for example IR(Infrared Ray). In this case, the application processor 2200 may mergethe image data provided from such a depth camera with the image dataprovided from other camera modules (e.g., 2100 a or 2100 b) to generatea three-dimensional (3D) depth image.

In some embodiments, at least two camera modules (e.g., 2100 a, 2100 b)among the plurality of camera modules 2100 a, 2100 b, and 2100 c mayhave different fields of view (viewing angles). In this case, forexample, although the optical lenses of at least two camera modules(e.g., 2100 a, 2100 b) among the plurality of camera modules 2100 a,2100 b, and 2100 c may be different from each other, the embodiments arenot limited thereto.

Also, in some embodiments, the fields of view of each of the pluralityof camera modules 2100 a, 2100 b, and 2100 c may be different from eachother. In this case, although the optical lenses included in each of theplurality of camera modules 2100 a, 2100 b, and 2100 c may be differentfrom each other, the embodiments are not limited thereto.

In some embodiments, each of the plurality of camera modules 2100 a,2100 b, and 2100 c may be placed to be physically separated from eachother. That is, the plurality of camera modules 2100 a, 2100 b, and 2100c do not dividedly use the sensing region of one image sensor 2142, butan independent image sensor 2142 may be placed inside each of theplurality of camera modules 2100 a, 2100 b, and 2100 c.

Referring to FIG. 23 again, the application processor 2200 may includean image processing device 2210, a memory controller 2220, and aninternal memory 2230. The application processor 2200 may be providedseparately from the plurality of camera modules 2100 a, 2100 b, and 2100c. For example, the application processor 2200 and the plurality ofcamera modules 2100 a, 2100 b, and 2100 c may be provided separately byor at separate semiconductor chips.

The image processing device 2210 may include a plurality of sub-imageprocessors 2212 a, 2212 b and 2212 c, an image generator 2214, and acamera module controller 2216.

The image processing device 2210 may include a plurality of sub-imageprocessors 2212 a, 2212 b and 2212 c corresponding to the number of theplurality of camera modules 2100 a, 2100 b, and 2100 c.

The image data generated from each of the camera modules 2100 a, 2100 b,and 2100 c may be provided to the corresponding sub-image processors2212 a, 2212 b, and 2212 c through the image signal lines ISLa, ISLb andISLc separated from each other. For example, the image data generatedfrom the camera module 2100 a is provided to the sub-image processor2212 a through the image signal line ISLa, the image data generated fromthe camera module 2100 b is provided to the sub-image processor 2212 bthrough the image signal line ISLb, and the image data generated fromthe camera module 2100 c may be provided to the sub-image processor 2212c through the image signal line ISLc. Although such an image datatransmission may be performed using, for example, a camera serialinterface (CSI) based on MIPI® (Mobile Industry Processor Interface),the embodiments are not limited thereto.

On the other hand, in some embodiments, one sub-image processor may beplaced to correspond to a plurality of camera modules. For example, thesub-image processor 2212 a and the sub-image processor 2212 c may not beprovided separately from each other as shown, but may instead beprovided by being integrated into a single sub-image processor. Theimage data provided from the camera module 2100 a and the camera module2100 c may be selected through a selection element (e.g., a multiplexer)or the like, and then provided to the integrated sub-image processor.

The image data provided to each of the sub-image processors 2212 a, 2212b, and 2212 c may be provided to the image generator 2214. The imagegenerator 2214 may generate an output image using the image dataprovided from the respective sub-image processors 2212 a, 2212 b, and2212 c according to image generating information or a mode signal.

Specifically, the image generator 2214 may merge at least some of theimage data generated from the camera modules 2100 a, 2100 b, and 2100 chaving different viewing angles according to the image generatinginformation or the mode signal to generate an output image. Further, theimage generator 2214 may generate an output image, by selecting any oneof the image data generated from the camera modules 2100 a, 2100 b, and2100 c having different viewing angles according to the image generatinginformation or the mode signal.

In some embodiments, the image generating information may include a zoomsignal (or zoom factor). Also, in some embodiments, the mode signal maybe, for example, a signal based on the mode selected from the user.

When the image generating information is a zoom signal (zoom factor) andeach of the camera modules 2100 a, 2100 b, and 2100 c have differentfields of view (viewing angle), the image generator 2214 may performdifferent operations depending on the type of the zoom signal. Forexample, when the zoom signal is a first signal, the image data that isoutput from the camera module 2100 a is merged with the image data thatis output from the camera module 2100 c, and then the output image maybe generated using the merged image signal and the image data that isnot merged and output from the camera module 2100 b. If the zoom signalis a second signal different from the first signal, the image generator2214 does not perform the image data merging, and may generate theoutput image by selecting any one of the image data that is output fromthe respective camera modules 2100 a, 2100 b, and 2100 c. However, theembodiments are not limited thereto, and the method of processing theimage data may be modified as necessary.

In some embodiments, the image generator 2214 may receive a plurality ofimage data with different exposure times from at least one of theplurality of sub-image processors 2212 a, 2212 b, and 2212 c, andperform an HDR (high dynamic range) process on the plurality of imagedata, thereby generating merged image data with an increased dynamicrange.

The camera module controller 2216 may provide control signals to each ofthe camera modules 2100 a, 2100 b, and 2100 c. The control signalsgenerated from the camera module controller 2216 may be provided to thecorresponding camera modules 2100 a, 2100 b, and 2100 c through thecontrol signal lines CSLa, CSLb and CSLc separated from each other.

One of the plurality of camera modules 2100 a, 2100 b, and 2100 c may bedesignated as a master camera (e.g., 2100 a) and the remaining cameramodules (e.g., 2100 b, 2100 c) may be designated as a slave camera,depending on the image generating information including the zoom signalor the mode signal. Such information is included in the control signaland may be provided to the corresponding camera modules 2100 a, 2100 b,and 2100 c through the control signal lines CSLa, CSLb and CSLcseparated from each other.

The camera modules that operate as master and slave may be modified,depending on the zoom factor or the operating mode signal. For example,when the viewing angle of the camera module 2100 a is wider than theviewing angle of the camera module 2100 c and the zoom factor shows alow zoom ratio, the camera module 2100 c may operate as a master and thecamera module 2100 a may operate as a slave. On the contrary, when thezoom factor shows a high zoom ratio, the camera module 2100 a mayoperate as a master and the camera module 2100 c may operate as a slave.

In some embodiments, the control signal provided from the camera modulecontroller 2216 to each of the camera modules 2100 a, 2100 b, and 2100 cmay include a sync enable signal. For example, when the camera module2100 b is the master camera and the camera modules 2100 a and 2100 c areslave cameras, the camera module controller 2216 may transmit a syncenable signal to the camera module 2100 b. The camera module 2100 b,which has received such a sync enable signal, generates a sync signal onthe basis of the received sync enable signal, and may provide thegenerated sync signal to the camera modules 2100 a and 2100 c throughthe sync signal line SSL. The camera module 2100 b and the cameramodules 2100 a and 2100 c may thus be synchronized with such a syncsignal, and may transmit the image data to the application processor2200.

In some embodiments, the control signal provided from the camera modulecontroller 2216 to the plurality of camera modules 2100 a, 2100 b, and2100 c may include mode information according to the mode signal. Theplurality of camera modules 2100 a, 2100 b, and 2100 c may operate inthe first operating mode or the second operating mode in relation to thesensing speed, on the basis of the mode information.

The plurality of camera modules 2100 a, 2100 b, and 2100 c may generatean image signal at the first speed in the first operating mode (forexample, generate an image signal of the first frame rate), encode theimage single at a second speed higher than the first speed (e.g., encodean image signal of a second frame rate higher than the first framerate), and transmit the encoded image signal to the applicationprocessor 2200. The second speed may be equal to or less than 30 timesthe first speed.

The application processor 2200 stores the received image signal, that isto say, the encoded image signal, in a memory 2230 provided inside or astorage 2400 outside the application processor 2200. After that, theapplication processor 2200 may read and decode the encoded image signalfrom the memory 2230 or the storage 2400, and display the image datagenerated on the basis of the decoded image signal. For example, thecorresponding sub-processors among the plurality of sub-processors 2212a, 2212 b, and 2212 c of the image processing device 2210 may performdecoding and may also perform image processing on the decoded imagesignal. For example, the image data generated on the basis of thedecoded image signal may be displayed on the display 2500.

The plurality of camera modules 2100 a, 2100 b, and 2100 c may generatean image signal at a third speed lower than the first speed in thesecond operating mode (e.g., generate an image signal of a third framerate lower than the first frame rate), and transmit the image signal tothe application processor 2200. The image signal provided to theapplication processor 2200 is a non-encoded signal. The applicationprocessor 2200 may perform image processing on the received image signalor store the image signal in the memory 2230 or the storage 2400.

The PMIC 2300 may supply power, for example, a power supply voltage, toeach of the plurality of camera modules 2100 a, 2100 b, and 2100 c. Forexample, the PMIC 2300 may supply first power to the camera module 2100a through the power signal line PSLa, supply second power to the cameramodule 2100 b through the power signal line PSLb, and supply third powerto the camera module 2100 c through the power signal line PSLc, underthe control of the application processor 2200.

The PMIC 2300 may generate power corresponding to each of the pluralityof camera modules 2100 a, 2100 b, and 2100 c and adjust the level ofpower, in response to the power control signal PCON from the applicationprocessor 2200. The power control signal PCON may include a poweradjustment signal for each operating mode of the plurality of cameramodules 2100 a, 2100 b, and 2100 c. For example, the operating mode mayinclude a low power mode, and the power control signal PCON may includeinformation about the camera module that operates in the low power modeand the power level to be set. The levels of power provided to each ofthe plurality of camera modules 2100 a, 2100 b, and 2100 c may be thesame as or different from each other. Also, the power level may bechanged dynamically.

In concluding the detailed description, those skilled in the art shouldappreciate that many variations and modifications may be made to theembodiments without substantially departing from the inventive concepts.Therefore, the disclosed embodiments of the inventive concepts are usedin a generic and descriptive sense only and not for purposes oflimitation.

What is claimed is:
 1. A camera module test apparatus comprising: amemory configured to store first coefficient data generated based on aratio of a first color image signal and a second color image signaloutput by sensing light penetrating through a first color filter havinga first arrangement, and second coefficient data generated based on aratio of a third color image signal and a fourth color image signaloutput by sensing the light penetrating through a second color filterhaving a second arrangement different from the first arrangement; and animage conversion device configured to select one of the firstcoefficient data and the second coefficient data based on an arrangementof color filters included in an image sensor of a camera module toconvert an image output from the image sensor into a converted image. 2.The camera module test apparatus of claim 1, wherein when thearrangement of the color filters included in the image sensor of thecamera module has the first arrangement, the image conversion device isconfigured to convert the image output from the image sensor using thefirst coefficient data.
 3. The camera module test apparatus of claim 1,wherein the converted image includes a gray image.
 4. The camera moduletest apparatus of claim 1, wherein the first arrangement of the firstcolor filter has an RGBW Bayer pattern.
 5. The camera module testapparatus of claim 4, wherein the first color image signal includes awhite color pixel value, and the second color image signal includes atleast one of a red color pixel value, a green color pixel value, and ablue color pixel value.
 6. The camera module test apparatus of claim 1,wherein the first and second arrangements do not include an RGB Bayerpattern.
 7. The camera module test apparatus of claim 1, furthercomprising: a calibration data generator configured to generatecalibration data of the converted image, wherein the calibration data istransferred to the camera module.
 8. A camera module test methodcomprising: providing a first camera module having a first color filter;receiving a first image signal output by sensing light penetratingthrough the first color filter of the first camera module; generatingfirst coefficient data corresponding to a ratio of a plurality of colorimage signals included in the first image signal; storing the firstcoefficient data; providing a second camera module having a second colorfilter; checking whether the second color filter matches the first colorfilter; and when the second color filter matches the first color filter,generating a first converted pattern image signal based on the storedfirst coefficient data and a second image signal output by sensing lightpenetrating through the second color filter of the second camera module,and generating calibration data of the first converted pattern imagesignal.
 9. The camera module test method of claim 8, further comprising:providing a third camera module having a third color filter differentfrom the first color filter; receiving a third image signal output bysensing the light penetrating through the third color filter of thethird camera module; and generating and storing second coefficient datacorresponding to a ratio of a plurality of color image signals includedin the third image signal.
 10. The camera module test method of claim 9,further comprising: checking whether the second color filter of thesecond camera module matches the third color filter; and when the secondcolor filter matches the third color filter, generating a secondconverted pattern image signal based on the stored second coefficientdata and a third image signal output by sensing light penetratingthrough the third color filter of the third camera module, andgenerating calibration data of the second converted pattern imagesignal.
 11. A camera module test apparatus comprising: a connectorconfigured to be removably connected to a camera module, the cameramodule including an image sensor that outputs an image signal responsiveto incident light; a coefficient generator configured to generatecoefficient data corresponding to a ratio of a plurality of color imagesignals included in the image signal, the image signal provided to thecoefficient generator through the connector; a memory device configuredto store the coefficient data; an image converter configured to receivethe image signal through the connector and convert the image signal intoa converted pattern image signal using the stored coefficient data; anda calibration data generator configured to generate calibration databased on the converted pattern image signal.
 12. The camera module testapparatus of claim 11, wherein the calibration data generator is furtherconfigured to store the calibration data in the memory device, and thestored calibration data is transferred from the memory device to thecamera module.
 13. The camera module test apparatus of claim 11, whereinthe converted pattern image signal is a gray image signal.
 14. Thecamera module test apparatus of claim 11, wherein the plurality of colorimage signals comprise a first color image signal including a whitecolor pixel value, and a second color image signal including at leastone of a red color pixel value, a green color pixel value, and a bluecolor pixel value.
 15. The camera module test apparatus of claim 11,further comprising a light source emitter configured to transmit thelight to be incident on the image sensor of the camera module asremovably connected to the connector.